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Resin Film, Paste Adhesive, Filler

Teijin’s resin and adhesive films are suitable for multiple temperature ranges and applications. The products range from epoxy resin films to high-temperature bismaleimide (BMI) and polyimide films, with the resin films supported by a polyester or glass carrier. Teijin also offers suitable resin and adhesive films for BMI systems.

Bismaleimide (BMI) systems

Product code Cure temperature Characteristics Applications
RM-30111 225°C Tough, cocurable film adhesive Aircraft sandwich structures

Polyimide (PI) systems

Product code Cure temperature Characteristics Applications
RM-1005 Initial bonding at 180°C with post cure Good tack, drape, and handling Metallic, composite, and sandwich bonding for harsh environments
RM-1014 300°C Good tack, drape, and handling Metallic, composite, and sandwich bonding for harsh environments
RM-1010 180°C with post cure Good tack, drape, and handling To co-bond with very-high-temperature polyimides
RM-1067      

Paste adhesives, fillers, etc.

Renegade™ offers high-temperature polyimide and BMI paste adhesives, filler material, and primers to provide a complete material package for your applications.

Bismaileimide (BMI) adhesives

Product code Cure temperature Characteristics Applications
RM-3006 225°C Paste adhesive Close-outs and shim paste
RM-3007 225°C Filled paste adhesive Potting, hard point filler, or liquid shim
Product code Cure temperature Characteristics Applications
RM-1005 (paste and prime)      
RM-1014 (paste and prime)      

Product Data Sheet

Contact us Data Sheet and Saftey Sheet on request

Typical applications

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